Month: February 2018 (page 1 of 4)

เปิดตัว Vivo X20 และ X20 Plus FullView Display 6.43 นิ้ว, Snapdragon 660, RAM 4GB, กล้องคู่!



เปิดตัว Vivo X20 และ X20 Plus สมาร์ทโฟนดีไซน์ FullView Display ใหม่ล่าสุด กับจอใหญ่ 6.43 นิ้ว, ขุมพลัง Snapdragon 660, RAM 4GB, กล้องคู่ (Dual-Camera) และ Android Nougat!
หลังจากที่มีข่าวคราวเกี่ยวกับ Vivo X20 ว่าที่สมาร์ทโฟนตัวท็อปกับดีไซน์โฉมใหม่หมดจด ในช่วงเดือนที่ผ่านมา ล่าสุดทาง Vivo ก็ได้ทำการเปิดตัว Vivo X20 และ X20 Plus เป็นที่เรียบร้อยแล้ว
Vivo X20 และ X20 Plus มาพร้อมการดีไซน์แบบใหม่ด้วยหน้าจอ FullView Display ขนาดใหญ่พร้อมอัตราส่วน 18 : 9 ที่กว้าง และยาวขึ้นกว่าเดิม บนตัวเครื่องที่ผลิตจากวัสดุประเภทโลหะ พร้อมความโค้งมนที่ด้านหลังเพื่อการจับถือกระชับมือ รวมถึงใช้งานกล้องถ่ายภาพแบบคู่ (Dual-Camera) ที่ด้านหลัง และฟีเจอร์จดจำใบหน้า (Facial Recognition) สำหรับปลดล็อกตัวเครื่อง
สรุปคุณสมบัติตัวเครื่องในเบื้องต้นของ Vivo X20
– ตัวเครื่องมีขนาด 155.85×75.15×7.2 มิลลิเมตร และมีน้ำหนัก 159 กรัม
– หน้าจอแสดงผลแบบ Super AMOLED ขนาด 6 นิ้ว ความละเอียดระดับ Full HD+ (1080×2160 พิกเซล)
– ชิปเซ็ตประมวลผล Octa-Core Qualcomm Snapdragon 660 ที่มีความเร็ว 2.2 GHz
– หน่วยประมวลผลกราฟิก (GPU) Adreno 512
– หน่วยความจำแรม (RAM) ขนาด 4GB
– หน่วยความจำภายใน (ROM) ขนาด 64GB และ 128GB พร้อมรองรับการ์ดหน่วยความจำภายนอกแบบ microSD สูงสุดที่ขนาด 256GB
– กล้องดิจิทัลด้านหลังแบบคู่ (Dual-Camera) ความละเอียด 12+5 ล้านพิกเซล พร้อมไฟแฟลช LED โดยมีขนาดรูรับแสงกว้างสูงสุดที่ F/1.8 และระบบป้องกันภาพสั่นไหวแบบ EIS
– กล้องดิจิทัลด้านหน้าความละเอียด 12 ล้านพิกเซล โดยมีขนาดรูรับแสงกว้างสูงสุดที่ F/2.0
– แบตเตอรี่ความจุ 3245 mAh
– ทำงานอยู่บนระบบปฏิบัติการ Android 7.1.1 Nougat
– เซ็นเซอร์สแกนลายนิ้วมือ (Fingerprint Scanner) และฟังก์ชันการจดจำใบหน้า (Facial Recognition)
– รองรับการใช้งานบนเครือข่าย 4G LTE
– รองรับการใช้งานพร้อมกัน 2 ซิมการ์ด (Dual-SIM)
– ชิปประมวลผลเสียงแยก AK4376A
– รองรับการเชื่อมต่อ Wi-Fi 802.11 a/b/g/n/ac และ Bluetooth 5.0
– รองรับการเชื่อมต่อแบบ microUSB 2.0
สรุปคุณสมบัติตัวเครื่องในเบื้องต้นของ Vivo X20 Plus
– ตัวเครื่องมีขนาด 165.32x80x7.45 มิลลิเมตร และมีน้ำหนัก 181 กรัม
– หน้าจอแสดงผลแบบ Super AMOLED ขนาด 6.43 นิ้ว ความละเอียดระดับ Full HD+ (1080×2160 พิกเซล)
– ชิปเซ็ตประมวลผล Octa-Core Qualcomm Snapdragon 660 ที่มีความเร็ว 2.2 GHz
– หน่วยประมวลผลกราฟิก (GPU) Adreno 512
– หน่วยความจำแรม (RAM) ขนาด 4GB
– หน่วยความจำภายใน (ROM) ขนาด 64GB พร้อมรองรับการ์ดหน่วยความจำภายนอกแบบ microSD สูงสุดที่ขนาด 256GB
– กล้องดิจิทัลด้านหลังแบบคู่ (Dual-Camera) ความละเอียด 12+5 ล้านพิกเซล พร้อมไฟแฟลช LED โดยมีขนาดรูรับแสงกว้างสูงสุดที่ F/1.8 และระบบป้องกันภาพสั่นไหวแบบ OIS
– กล้องดิจิทัลด้านหน้าความละเอียด 12 ล้านพิกเซล โดยมีขนาดรูรับแสงกว้างสูงสุดที่ F/2.0
– แบตเตอรี่ความจุ 3905 mAh
– ทำงานอยู่บนระบบปฏิบัติการ Android 7.1.1 Nougat
– เซ็นเซอร์สแกนลายนิ้วมือ (Fingerprint Scanner) และฟังก์ชันการจดจำใบหน้า (Facial Recognition)
– รองรับการใช้งานบนเครือข่าย 4G LTE
– รองรับการใช้งานพร้อมกัน 2 ซิมการ์ด (Dual-SIM)
– รองรับระบบเสียงระดับ Hi-Fi และชิปประมวลผลเสียง ES9318 DAC
– รองรับการเชื่อมต่อ Wi-Fi 802.11 a/b/g/n/ac และ Bluetooth 5.0
– รองรับการเชื่อมต่อแบบ microUSB 2.0
สรุปราคา และกำหนดการวางจำหน่าย
ทาง Vivo จะเปิดให้ทำการสั่งจองล่วงหน้า (Pre-Order) สำหรับ Vivo X20 และ X20 Plus ในวันที่ 25 กันยายน และวางจำหน่ายอย่างเป็นทางการในจีนวันที่ 30 กันยายนตามลำดับ โดยเปิดราคาวางจำหน่ายดังนี้
– Vivo X20 (64GB) ราคา 2,998 หยวน หรือประมาณ 15,000 บาท
– Vivo X20 (128GB) ราคา 3,398 หยวน หรือประมาณ 17,000 บาท
– Vivo X20 Plus ราคา 3,498 หยวน หรือประมาณ 17,600 บาท

source

Technical SPECS of Vivo X20 Plus Cell Phone

GENERAL
Release date Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Detachable battery No
Colors Black
Screen
Display dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor 1.8GHz octa-core
Processor Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Primary camera 12 mega-pixel
Rear Flash Yes
Selfie camera 12 mega-pixel
SOFTWARE
OS Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Headsets 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

【爱范儿视频】vivo X20 Plus:除了主打的逆光人像,还有哪些亮点?



主打逆光拍照的 vivo X20 Plus,不只是会拍照,今年的手机潮流元素:全面屏,面部识别解锁也没少。一起来看看吧

source

Specifications of Vivo X20 Plus Phone

Basic
Release date Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Detachable battery No
Colors Black
Screen
Display screen dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor chip 1.8GHz octa-core
Processor chip Qualcomm Snapdragon 660
RAM 4GB
Internal storage 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable TF card up to (GB) 256
CAMERA
Rear camera 12 mp
Rear Flash Yes
Selfie camera 12 mp
SOFTWARE
OS Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Earphones 3.5mm
Radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

High TG Electronic Circuit Board Manufacturer In China



OurPCB Tech Limited(www.ourpcbte.com) was founded in 2005, We have provided a professional Printed circuit board & PCB Assembly services for more than 2,500 customers around the globel.

Source

High TG Electronic Circuit Board Manufacturer In China

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Leadsintec Inc.

Leadsintec Co.,Ltd is an electronic manufacturing service (EMS) specialist positioned in Shenzhen China since 2004. Being an ISO 9001 licensed electronics contract producer, we provide a range of PCB, component sourcing, PCB assemblage, box-build, testing services.

Thanks to the previous 11+ years ample expertise in manufacturing, Leadsintec has won a solid acceptance in China and abroad. Our goods are mainly used in the Electronics Market , Industrial, Automation, Motor vehicle, Agriculture, Defense, Aerospace, Health-related and also Security industries.

Our commitment is to aid small and mid-sized shoppers in lessening their expenditure by providing overall solutions, high-mixed, low and medium volume services. Utilizing our expert process administrators, process specialists, production personnel and sourcing experts, we are now competent to grasp and exceed your wants.

Leadsintec’s fabricating plants consist of neat workshops and superior high-speed SMT product lines. Our chip placement precision can easily get to +0.1MM on integrated circuit parts. It indicates we can easily address practically a myriad of integrated circuits, e . g . SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA as well as U-BGA. In addition, we can easily provide 0201 chip placement, through-hole component insertion and ended product production, test and packaging.

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STG

Based on : http://china-pcbassembly.com/factory-view-n100-1.html

One-stop PCB Board assemblage service vendor

(Backing up private label PCB Board )

STG is a top notch qualified PCB Board and PCBA producer in China, which provides OEM/ODM service for global consumers . With many years of experiences, STG is not only a maker, but in addition a qualified designer for emerging ideas, new creations in line with clients. Our range of products contains assorted fields, like electronics, telecommunications, industrial products , auto assemblies, medical equipment and many more.

Our primary services comprise of electronics and metal casing mfg, including printed circuit boards PCB Board manufacturing, component purchase, PCB Board assemblage, plastic/metal house build, die-casting as well as customizable manufacturing. With proficient working team at STG fully trained, their capabilities will be impressive.

Contact STG

China Shenzhen Office

Telephone: +86-0755-27929725
Telefax: +86-0755-27929724
Email address: sales@stgpcba.com

Address: Huolibao Building 5F , Technology Park, Nanshan, Shenzhen, 518100, China.
Web: www.china-pcbassembly.com

Hong Kong Office

Tel: 852-36458129
Telefax: 852-36458092
Email address: marketing@stgpcba.com.
Address: 11/F FRONT BLK,HANG LOK BLDG 130 WING LOK ST,SHEUNG WAN, Hong Kong
Site: www.china-pcbassembly.com

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Asia Pacific Circuits – Turnkey service for PCB Board Assemblage & PCB Board Fabrication

Depending on : http://apc-pcbassembly.com/about-us-asia-pacific-circuits/

Asia Pacific Circuits Co., Ltd targets PCB Board fabrication and assemblage, including prototype and production PCBs. Here at APC We supply premium quality and cost-effective Electronic Contract Manufacturing Services – including PCB Board fabrication, components purchasing and one-stop PCB assemblage. With state-of-the-art manufacturing unit and technology advances, we cater to customers in a wide variety of industries.

We are dedicated to your whole satisfaction. Time to market is a symbol of how the company’s time-critical, Turnkey fabrication services empower clients to reduce the period of time essential to develop new merchandise and put them to market.

Asia Pacific Circuits facilities are ISO9001-2008 approved, ISO 14001 (Environmental), UL Recognized, TS16949, TSTS13485 eligible, IPC-A-600 and IPC-A-610 3 compliant. Our company has a PCB assemblage facility and a PCB Board manufacturing facility in China Shenzhen. APC business range covers – PCB Board Prototype, low to middle and high volume PCB Board fabrication and PCB Board assemblage services.

Subsequent to APC staff members 18 years of diligent efforts to make a great sales network, We created a complete management system, gained the ISO9001: 2008 international quality management system certification. We possess a highly trained sales, PCB Board fanufacture and PCB assemblage under one roof, enhance the sales operation and producing and testing hardware to ensure only qualified boards are provided to the buyer .

Get in touch with Us

Asia Pacific Circuits Co., Ltd
Office Telephone: +86-755-2758-4025
Office Telefax: +86-755-2758-4028
Email address: sales@apc-pcbassembly.com
Office Address: No. 55A, Baoan Ave, Bao’an District, Shenzhen , 518102, China
Factory Address: Gaoqiao Industrial Park East, Yanlong Ave, Longgang District, Shenzhen, China

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MOKO Tech Limited

We Provide a Wide Range of PCB Board Capabilities to Fit Every One of your PCB Requirements.

Moko Tech Limited created in 2001, located within Shenzhen, China. is an expert in printed circuit board mfg plus printed circuit board assembly, located in Shenzhen, Guangdong, China. We are focused upon fabricating single-sided , double-sided and multi-layer board, as many as 18 layers. What’s more, we could make available parts buying and turn-key printed circuit board assembly service.

With above 10 years in the industry of printed circuit board prototype and manufacturing, we’re committed to meeting the wants of our shoppers from diverse industries with regard to level of quality, shipping and delivery, cost-effectiveness and every other request(s). As being among the list of most skilled printed circuit board makers in China, we have confidence to be your most important partners .

In China, we’re recognized as the high-quality provider for a large amount of corporations globally. We offer you a variety of services including printed circuit board mfg and printed circuit board assembly for from prototype orders to batch orders.

Regarding printed circuit board assembling, employing 8 high-speed SMT assembling lines brought in from Japan Yamaha and Sony, we make our uttermost to meet our shoppers’ expectations.

One-stop Service: Above PCB Board Fabrication

Our grown experience in electronic boards is not simply tied to printed circuit board mfg but extends to almost all related services for example printed circuit board design & layout and printed circuit board assembly. Our highly trained design specialists can help you realize economical brilliance in your multi-layer design or we can easily design your circuit over completely from scratch: from a easy double-sided board to complex rigid-flex PCB applications. In the year 2012, our subcompany – Shenzhen Eastwin Trading Limited founded in order to stretch international Market.

We have our 25,000 square ft. revolutionary manufacturing unit to offer the quality consistency you desire…

We now have gathered the ISO9001:2000, ISO14001, UL and also ROHS qualifications. Right away our printed circuit board volume has reached One thousand sqm. every day, and as for printed circuit board assembly can achieve 100,000,000 items a month.

We sincerely reckon that our reliable service and expertise will entirely fulfil your requires. Trustworthiness and new technology are the power that drive our achievement. We are the best solution for you.

For further products and services, more incentives, or free of charge trial samples remember to

Touch Base with Us

MOKO Tech Ltd.
Telephone Number: 86-75523573370
Telefax: 86-75523573370-808
Mailbox: jenny@mokotechnology.com.cn
Address : 4F,Buidling #2,Guanghui Technology Zone,Minqing Rd, Longhua Town, Shenzhen , China
Zip Code: 518109

Based on http://mokotechnology.com/about/

Vivo X20 Plus vs Xiaomi Mi MIX 2



http://digitaltechnologynews.com/
Vivo X20 Plus vs Xiaomi Mi MIX 2 Smartphones
Vivo X20 Plus
The new Vivo X20 Plus feature a 12MP primary sensor with f/1.8 aperture and a secondary 5MP cam, 12MP front-facing selfie shooter with f/2.0, Full View Super AMOLED display, 1080 x 2160 pixel resolution, Snapdragon 660 processor, 4GB RAM, 64GB onboard storage, microSD card slot for memory expansion (256GB max), and the usual sensors (Wi-Fi, 4G, USB 2.0, Bluetooth 5.0, and GPS). The two phones run Android 7.1.1 Nougat topped by FunTouch OS and feature fingerprint sensor at the back.

Xiaomi Mi MIX 2
The Mi MIX 2 sports the current top-of-the-line SoC from Qualcomm, the Snapdragon 835, and combines it with a generous 6 GB of RAM. There are three storage options: 64 GB, 128 GB, and 256 GB. On the ceramic back of the phone you can find a fingerprint reader and the main 12-megapixel camera with dual LED flash.

source

Specs of Vivo X20 Plus Smart Phone

Basic
Release day Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colours Black
Screen
Display measurement (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 pixels
HARDWARE
CPU 1.8GHz octa-core
CPU Qualcomm Snapdragon 660
RAM 4GB
Internal storage 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable MicroSd card up to (GB) 256
CAMERA
Backside camera 12 mp
Rear Flash Yes
Selfie camera 12 mp
SOFTWARE
Operating-system Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infra-red No
USB OTG Yes
Earphones 3.5mm
Radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

รีวิว vivo X20 นี่สิของจริงที่รอคอย รับรองสมกับที่รอคอย



ต้องยอมรับเลยว่า นี่มันโทรศัพท์จริง 2017 ชัดๆ มือถือที่มาพร้อมกับการ Entertain ชีวิตตัวเอง ทั้งกล้องหน้าที่ยัด Dual Pixel มา ไหนจะ Hi-Fi DAC อีก แถมมี AMP อีก กล้องหลังคู่ แถมมี OIS อีก มาพร้อมกับขุมพลัง Snapdragon 660
ติดตามพวกเราต่อได้ที่
www.facebook.com/stepgeektv
lifeisgadget@gmail.com
https://shopee.co.th/stepgeek
โทร 095-9642699 ติดต่อซื้อมือถือ หรือ ติดต่อสินค้ารีวิว

source

Specifications of Vivo X20 Plus Smartphone

GENERAL
Release day Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colours Black
DISPLAY
Display measurement (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 pixels
HARDWARE
CPU 1.8GHz octa-core
CPU Qualcomm Snapdragon 660
RAM 4GB
Internal storage space 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable memory card up to (GB) 256
CAMERA
Primary camera 12 megapixel
Rear Flash Yes
Selfie camera 12 megapixel
SOFTWARE
Operating-system Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Earphones 3.5mm
FM radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Распаковка vivo x20 Plus и Tronsmart T6

source

Technical SPECS of Vivo X20 Plus Cell Phone

Basic
Release day Jan 2018
Measurements (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Detachable battery No
Colors Black
DISPLAY
Display dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 pixels
HARDWARE
Processor 1.8GHz octa-core
Processor Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable MicroSd card up to (GB) 256
CAMERA
Rear camera 12 megapixel
Rear Flash Yes
Selfie camera 12 megapixel
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Earphones 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Voja Antonic: Hacking the SuperConference Badge



There are only a handful of people who can say they’ve built several successful electronic badges for conferences. Voja Antonic is not just on that list, he’s among the leaders in the field. There are a lot of pressures in this type of design challenge: aesthetics, functionality, and of course cost. If you want to know how to make an exposed-PCB product that will be loved by the user, you need to study Voja’s work on the 2016 Hackaday SuperConference Badge.

Voja took ill leading up to the conference. He made it to the event but without a voice he asked Mike Szczys to give his badge design talk for him.

Read the article:
What Makes the Perfect Hardware Badge

Learn more about the SuperConference Badge:
https://hackaday.io/project/16401

Learn more about the Hackaday SuperConference:
https://hackaday.io/superconference/

Source

Internet of Things PCB ways to care for Startups

Considering that IoT products are so cutting edge, you would assume that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and finding your way through a whole lot of technical problem. That may be far from the truth.
Nevertheless it doesn’t imply IoT startups have a apparent route to stardom. Facing them is many different design and manufacturing factors to consider which are distinctive to these small products. These factors need to be thought of for the new IoT device to achieve success.

On the plus side, it’s necessary for IoT startups to understand that the basic foundation for a successful awesome product exists. What this means is experience and knowledge relating to the design, fabrication and assembly of these kinds of innovative products are obtainable. Additionally, the best advice is for discreet IoT product businessmen and leaders to focus on the advice that professional electronics manufacturing services or EMS vendors have to give you. These businesses and also their engineering team members have performed the job with revolutionary IoT businesses in Silicon Valley moving into the very first of this surfacing field.

The PCB of an IoT device is a special beast than the traditional one, which is a great deal larger and flat. IoT gadgets, on the flip side, consist generally of either rigid-flex or flex circuit assemblies, which come with their own sets of design layout, fabrication and assembly factors and subtleties.

Layout

A principal concern is to try to find expert designers who’ve achieved a considerable amount of rigid-flex PCB designs. PCB space for an IoT device is scarce. So you want the designer to have firsthand layout knowledge to successfully design crucial components on that limited space.

In addition, the majority of IoT devices aren’t fixed; they sustain sizeable movement and folding. Here, the expert designer plays a significant role in computing bend ratios and lifecycle iterations as a important part of a design. Some other crucial design layout factors comprise of signal trace thickness, number of rigid and flex circuit layers, copper weight and stiffener placement. Stiffeners are utilized on flex circuits to guarantee components mounted on the flex circuit continue to be closely in position to stop movement.

One more account is through-hole part placement in rigid-flex circuits. How come is that critical? Nearly all of IoT items are founded on surface mount device placement. But nonetheless , there could be through-hole components, which are usually put on either the rigid portion or the flex area of the board. Through-hole components are in most cases used to connect input/output or I/O signals to the exterior world. That way, those signals can be demonstrated employing an LCD or LED monitor. Through-hole part placement is a significant consideration in an IoT item considering that when attached to the flex part of the board, appropriate stiffeners should be designed and implemented for excellent assembly.

Then finally in the layout category, the heat which components bring in must be considered. IoT devices are more and more complicated with rigid-flex and flex circuits featuring approximately 12 – 14 layers. Some devices are digital. But nonetheless , increasingly analog units are being exercised in IoT units. Analog circuitry produces considerably more heat than digital ones. This would mean heat expansion as well as contraction rate has to be taken into account. In tech lingo, this is actually generally known as the Coefficient of Thermal Expansion or CTE and the correct remedy for it.

Manufacturing

Choosing the best fabricator is essential and is linked to the EMS partner you have picked out. The fabricator you’d like require IoT PCB fabrication practical experience. Among crucial factors here are insuring durable adhesions between layers on both rigid and flex circuit sides, figuring out all of the crucial calculations and obtaining an excellent comprehension of when current transfers from the rigid side to the flex side.

These fabricators should also have an in-depth comprehension of tremendously compact parts for instance 0201 and 00105 device packages, package-on-package, and the employment of fine-pitch ball-grid array or BGA packaged devices.

Furthermore they ought to have knowledge of designing boards with very tight tolerances in terms of footprint for those kinds of BGA devices, in terms of up-to-date capabilities like laser direct imaging for putting the solder mask on the board. They ought to have laser drills for via drilling with sizes of 5 mils or under mainly because these IoT devices could be so little that a common drill size of 5 to 8 mils may not be all you need. They might have to go to a 3 mil, which means you need to have an superior laser drilling capability on-site.

In cases where you are placing via-in-pad, it’s really a good way to utilize the small land that is available on the rigid-flex board, but it produces problems for assembly. If vias are not 100 % planar or flat in shape, it might be tricky through the assembly of those tiny BGA packaged devices. This comes about because non-planar surfaces might threaten the integrity of solder joints.

Occasionally via in pads leave bumps in the event they’re not scrubbed thoroughly after adding the vias and gold finish on the top. In cases where there are bumps, then the solder joints in the assembly for those tiny BGA balls in those IoT devices would not be an excellent joint. This may create sporadic connections, which might be a greater issue to treat and take care of. It all boils down to which EMS partner you’re choosing because they’re the ones who will select the fabrication house to make a profitable IoT device for you.

PCB Assembly

It’s very important to pay a visit to expert EMS companies that have proficiently assembled IoT and wearable PCBs since they have specialized tooling and fixtures readily obtainable, which are vital for assembly to guarantee components are placed perfectly, precisely and the printing is accomplished perfectly.

Printing could be a headache for IoT units. If it’s a rigid-flex board, then there’s a difference between thicknesses of the rigid and flex circuit portions, indicating a special fixture is needed to keep the complete rigid-flex board planar or entirely flat to allow for effective printing to become achieved.

Startups ought to be all set to select the proper manufacturing partners and EMS businesses. Doing this they can guarantee they have got ample experience before hand to get the multitude of design, fabrication and assembly details efficiently performed as they are key to a victorious and punctual IoT product launch.

เปิดตัว vivo X20 x20 plus กล้องหน้า Dual Pixel ขึ้นแท่นเจ้าแห่งการ Selfie พร้อม Hi-Fi DAC + AMP



ต้องยอมรับเลยว่า นี่มันโทรศัพท์จริง 2017 ชัดๆ มือถือที่มาพร้อมกับการ Entertain ชีวิตตัวเอง ทั้งกล้องหน้าที่ยัด Dual Pixel มา ไหนจะ Hi-Fi DAC อีก แถมมี AMP อีก กล้องหลังคู่ แถมมี OIS อีก มาพร้อมกับขุมพลัง Snapdragon 660
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Specifications of Vivo X20 Plus Cell Phone

GENERAL
Release date Jan 2018
Dimensions (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Removable battery No
Colours Black
DISPLAY
Screen dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor chip 1.8GHz octa-core
Processor chip Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Primary camera 12 megapixel
Rear Flash Yes
Front camera 12 megapixel
SOFTWARE
OS Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infra-red No
USB OTG Yes
Headphones 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Vivo X20 Plus UD – czy Smartfon z Czytnikiem Linii Papilarnych w Ekranie Trafi do Sprzedaży!



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Czy czytniki linii papilarnych mają jeszcze sens bytu? Czy w dobie skanerów oczów i twarzy może nas cokolwiek zaskoczyć? Firma Vivo udowadnia, że jak najbardziej!

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Specifications of Vivo X20 Plus Smartphone

Basic
Release day January 2018
Dimensions (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colors Black
Display screen
Display screen dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor 1.8GHz octa-core
Processor Qualcomm Snapdragon 660
RAM 4GB
Internal storage 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Primary camera 12 mega-pixel
Rear Flash Yes
Front camera 12 mega-pixel
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Headphones 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Vivo X20 Plus UD (2018)



Hey guys! Vivo won the unique distinction of being the first to market with a smartphone accommodating an in-screen fingerprint sensor at CES 2018. While Vivo showcased the device at the world’s largest consumer electronics gathering, it didn’t share particular details of the device bearing the feature.

The Vivo X20 Plus UD is expected to sport similar hardware design and specifications as the previously launched Vivo X20 Plus. Just to recap, the Vivo X20 Plus features a 6.43-inch full-HD+ (1080×2160 pixels) Super AMOLED display with an 18:9 aspect ratio. The phone is powered by an octa-core Qualcomm Snapdragon 660 SoC, coupled with 4GB of RAM and 64GB of inbuilt storage. The storage is expandable via microSD card (up to 256GB).

Other specifications include Snapdragon 660 chipset coupled with 4GB RAM and 128GB internal storage.
The Vivo X20 Plus UD with an under display fingerprint sensor is expected to arrive on January 25, 2018 for a price of CNY 3,998 (roughly Rs. 39,900)

So, keep watching…

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Technical SPECS of Vivo X20 Plus Phone

Basic
Release date Jan 2018
Dimensions (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colours Black
Display screen
Display screen dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor 1.8GHz octa-core
Processor Qualcomm Snapdragon 660
RAM 4GB
Internal storage space 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Back camera 12 mp
Rear Flash Yes
Front camera 12 mp
SOFTWARE
Operating-system Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Earphones 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

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