Month: March 2018 (page 1 of 5)

搞机零距离:全球首款屏幕下指纹识别手机终于量产了!vivo X20 Plus上手体验



微博:@钟文泽

source

Specifications of Vivo X20 Plus Mobile Phone

Basic
Release date Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colors Black
Display screen
Screen size (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor chip 1.8GHz octa-core
Processor chip Qualcomm Snapdragon 660
RAM 4GB
Internal storage 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Back camera 12 mega-pixel
Rear Flash Yes
Selfie camera 12 mega-pixel
SOFTWARE
Operating-system Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infrared No
USB OTG Yes
Headsets 3.5mm
Radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Vivo X20 Plus UD Hands-on with In-Display Fingerprint Technology



Vivo X20 Plus UD with In-Display Fingerprint Technology to be used in the Vivo X20 Plus.

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Technical SPECS of Vivo X20 Plus Smartphone

Basic
Release day January 2018
Measurements (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Removable battery No
Colours Black
DISPLAY
Display measurement (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
CPU 1.8GHz octa-core
CPU Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable TF card up to (GB) 256
CAMERA
Back camera 12 megapixel
Rear Flash Yes
Front camera 12 megapixel
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infra-red No
USB OTG Yes
Headsets 3.5mm
Radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Contactless payment using smart wearables



www.infineon.com/wearable-devices

Presenting Infineon’s breakthrough Boosted NFC Secure Element in innovative smart wearable devices.
Infineon’s Boosted NFC Secure Element is an all-in-one solution for secure NFC payments. Combining ultra-low power consumption and an ultra-small PCB footprint with extraordinary contactless performance, it is the perfect fit for today’s smart wearable devices.

Source

IoT PCB things to consider for Startups

Given that IoT appliances are so cutting edge, you would assume that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and suffering from a wide range of technical trouble. That is most certainly untrue.
Nevertheless it doesn’t indicate that IoT startups have a straightforward approach to fame and fortune. Facing them is a lot of design and manufacturing issues which are completely unique to these small products. These considerations should be thought of for the new IoT device to be successful.

On the plus side, it’s essential for IoT startups to find out that the foundation for a successful cool product exists. What this means is experience and knowledge regarding the design, fabrication and assembly of these complex products are accessible. Additionally, the best advice is for heady IoT product entrepreneurs and forerunners to heed the counsel that knowledgeable electronics manufacturing services or EMS providers offer. These corporations and also their engineering team members already have undertaken this work with revolutionary IoT companies in Silicon Valley participating in the very first of this rising market.

The PCB of an IoT unit is a distinct beast than the traditional one, which is substantially larger and flat. IoT units, on the other hand, consist mainly of either rigid-flex or flex circuit assemblies, which include their very own categories of design layout, fabrication and assembly considerations and detailed aspects.

Layout

A primary factor is to hunt down professional designers who’ve finished loads of rigid-flex PCB designs. PCB space for an IoT unit is tight. So you want the designer to have directly layout practical experience to successfully design vital elements on that small space.

On top of that, almost all IoT systems are not fixed; they sustain extensive movement and turning. Here, the professional designer plays an essential role in working out bend ratios and lifecycle iterations as a serious part of a design. Additional vital design layout considerations include signal trace thickness, number of rigid and flex circuit layers, copper weight and stiffener placement. Stiffeners are employed on flex circuits to make sure that elements connected to the flex circuit continue being tightly in place to stop movement.

An extra concern is through-hole element placement in rigid-flex circuits. Why’s that key? Most IoT devices are founded on surface mount device(SMD) placement. Nevertheless , there could be through-hole elements, which are typically attached to either the rigid portion or the flex part of the board. Through-hole elements are normally used to connect input/output or I/O signals to the outer world. That way, those signals can show up employing an LCD or LED monitor. Through-hole element placement is a critical concern in an IoT device because when applied on the flex part of the board, appropriate stiffeners have to be designed and applied for ideal assembly.

Eventually in the layout category, the heat which elements generate ought to be taken into consideration. IoT systems are starting to be sophisticated with rigid-flex and flex circuits featuring as many as 12 – 14 layers. A few systems are digital. Nevertheless , more and more analog systems are being exercised in IoT systems. Analog circuitry delivers a great deal more heat than digital ones. It implies heat expansion and also contraction rate has to be considered. In tech lingo, that is termed as the Coefficient of Thermal Expansion or CTE and the effective handling of it.

Manufacturing

Choosing the right fabricator is essential and is linked to the EMS enterprise you have decided on. The fabricator you’re looking for has to have IoT PCB fabrication practical experience. Amongst vital considerations here are ensuring solid adhesions between layers on both rigid and flex circuit sides, realizing all of the crucial calculations and getting a strong comprehension of when current moves from the rigid side to the flex side.

Such fabricators also need to have an in-depth comprehension of very small parts like 0201 and also 00105 device packages, package-on-package, and the utilization of fine-pitch ball-grid array or BGA packaged devices.

Additionally they must have experience in designing boards with truly tight tolerances in terms of footprint for those types of BGA devices, in terms of up-to-date capabilities like laser direct imaging for putting the solder mask on the board. They need to have laser drills for via drilling with sizes of 5 mils or under mainly because these IoT products could be so compact that a typical drill size of 5 to 8 mils may not be sufficient. They could need to go to a 3 mil, meaning you should get an leading-edge laser drilling capability on-site.

In cases where you’re placing via-in-pad, it’s a good way to make use of the small space that’s available on the rigid-flex board, but it poses problems for assembly. If vias are not completely planar or flat in shape, it may be an issue over the assembly of those tiny BGA packaged devices. That’s because non-planar surfaces may put in danger the integrity of solder joints.

At times via in pads leave bumps if they’re not scrubbed thoroughly after installing the vias and gold finish on top. In the event there are bumps, then the solder joints in the assembly for those tiny BGA balls in those IoT devices wouldn’t be a great joint. It may create intermittent connections, which can be a larger issue to cope with and improve. It all boils down to which EMS enterprise you’re choosing because they’re the ones who will find the fabrication house to make a profitable IoT device for you.

PCB Assembly

It’s vital to pay a visit to professional EMS companies that have correctly assembled IoT and wearable PCBs as they have specialized tooling and fixtures already available, which are needed for assembly to make sure that components are placed properly, exactly and the printing is performed appropriately.

Printing is usually a obstacle for IoT systems. If it’s a rigid-flex board, then you will find there’s a difference between thicknesses of the rigid and flex circuit portions, signifying a special fixture is required to retain the complete rigid-flex board planar or completely flat to make effective printing to become carried out.

Startups really should be well prepared to discover the suitable manufacturing partners and EMS corporations. By doing this they can be certain they have enough experience in advance to get the multitude of design, fabrication and assembly details effectively performed as they are key to a successful and on time IoT product roll-out.

Vivo X20 Plus Official Full Specs, Price and Sales Details!



Here is the Vivo X20 Plus Official Full Specifications, Price, and Availability information

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♪ Music Copyright
Track: Defqwop – Say The Word (feat. The Ruins) [NCS Release]
Music provided by NoCopyrightSounds.
Watch: https://youtu.be/BXuiGkthhxY
Free Download / Stream: http://ncs.io/SayTheWordYO

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Specifications of Vivo X20 Plus Smart Phone

GENERAL
Release day January 2018
Dimensions (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colours Black
Screen
Display measurement (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 pixels
HARDWARE
CPU 1.8GHz octa-core
CPU Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable TF card up to (GB) 256
CAMERA
Backside camera 12 mp
Rear Flash Yes
Selfie camera 12 mp
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
IR No
USB OTG Yes
Headsets 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Circuit Board and Wholesale Fitness Band Exporter Located In Shenzhen

Circuit Board and Wholesale Fitness Band Exporter Located In Shenzhen

MOKOSmart Technologies Ltd

Founded in 2003, MOKOSmart is a qualified professional vendor of Private-brand Smart Wifi Plug and Printed Circuit Board. We is devoted to EMS (electronics manufacturing support) for roughly 15-year which include Printed Circuit Board Design & Layout, Circuit Board Fabrication, Electronic Circuit Board Assembly, PCBA Prototype, PCBA Test, Electronic Component Finding and Producing for kinds of smart electronic production including, iBeacons, etc.

Circuit Board Design & Layout
You show us a schematic, we offer you a circuit board, even you give us a thought, we make it become a reality. MOKOSmart has an experienced specialist team to design your PCB solutions irrespective of whether it is big or small. With top notch software and specialist knowledge by the standard of industrial first-rate level, we are on the odometer to one of the most suitable Circuit Board companies.

PCB Board Fabrication (Electronic Circuit Board FAB)
As being a qualified professional Circuit Card maker in China started in 2003, until now we have produced a lot of Electronic Circuit Boards consisting of FR4, FR1, CEM1, FPC, Metal Core PCB Board and Rogers Circuit Board, etcetera. With the benefit of material and component sourcing channels, we have the ability of fast PCB sample –48 hours after order confirmation.

MOKOSmart Limited gives you one-stop Printed Circuit Board assembly services for electronics manufacturing, from components sourcing, PCB production, SMT, DIP, Circuit Board assembly to finished product assembly. With the superiority of huge-scale purchasing (of IC, resistances, capacitance, inductance, diode and audion, etc.) and quality-first sense, we contract with the exceptional component suppliers from China and aboard to generate long-term relationship, this makes sure original quality and constant supply, aiming at transmitting the benefit to our clients. We have been working with the customers from United states of america, Germany, Russia, Israel, Iran, India, Mexico, Argentina, Colombia, etcetera.

SMT Processing Line
We’ve got 8 SMT Lines and 3 DIP Lines to implement Circuit Card assembly. The accuracy and precision of chip replacement is up to +0.1MM, revealing we have specialist skills in manufacturing heaps of different printed integrated circuit boards which include SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA with surface-mount technology (SMT), thru-hole technology (THT) and combined tech chips.

DIP Assembly Production Line
MOKOSmart has 3 DIP processing lines, qualified working platforms and carriers, which ensures a yield of 1,500,000 pieces on a daily basis. For every process, technical and standard operation procedures are made to follow, with strict KPI, this makes sure of 99.8% of pass for each and every PCBA. Bring down our defects, result in more value for customers.

With ISO9001, SGS, CE, FCC, ROHS, UL and MSDS certified, we are presenting complete PCB Assembly services for some known OEM customers who look closely at marketing and advertising and designing in the industries of consumer electronics, security control, industrial automation, medical & well being, counter gadgets et cetera, in addition, also making varieties of modules such as tracker wristbands, WiFi / nRF51822 Bluetooth LE modules, smart plugs and Bluetooth beacons.

100Pct total satisfaction is our motive to create for our customers and partners, which is assisting us establish win-win business model and grow with our clients. With your assistance, we’ll be one of the most suitable Chinese PCB & PCB Assembly vendors.

Connect with Us

Contact page form: https://www.mokosmart.com/
Location: 4F, Building No.2, Guanghui Science Park, MinQing Road, Longhua Dist., Shenzhen City, China Zipcode: 518109
Factory Location: Building #1 3F, Shenlan Industrial Park, No.240 Fuqian RD, Guanlan, Longhua District, Shenzhen, 518110

 

Solar Energy Printed Circuit Board Company Located within China Mainland



Sales Manager : lixun Tel : 86-0769-89974904 mobile: +8615818290872
FPC /PCB punching (HYPL)
1. Cast iron frame work for rigidity.
2. Easy and safty operation.
3..Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual.
4.Punching dies are changeable. Easy set up of punching dies.
5.Moveable lower die for easy loading and unloading PCB punch die/FPC die/PCB punch mold/ FPC mould.
6. High efficient for punching semi-finished PCB/FPC.

Specification:

Size
930×880×1230mm

Punch power
8T

Working air pressure
0.50-0.70Mpa

Working area
460×320mm

Weight
530kg

Source

Solar Energy Printed Circuit Board Company Located within China Mainland

12-pwb-pcb-factories-01

Leadsintec Inc.

Leadsintec Co.,Ltd is an electronic manufacturing service (EMS) professional in Shenzhen China since 2004. As an ISO 9001 licensed electronics contract producer, our company offers a variety of circuit board, component purchase, circuit board assy, box-build, testing services.

Attributable to the earlier 11+ years rich expertise in manufacturing, Leadsintec has developed a fine standing in China and worldwide. Our goods are mainly used in the Electronics Market , Industrial, Automation, Vehicle, Agriculture, Defense, Aerospace, Health-related and also Home security industries.

Our purpose is to aid small , mid-sized clients in lessening their expenditure by offering total options, high-mixed, low and medium volume services. Utilizing our competent program supervisors, process technical engineers, production team members and purchase experts, we are now competent to fully understand and go beyond your wants.

Leadsintec’s production facilities consist of clean work spaces and advanced high-speed SMT product lines. Our chip placement precision can hit +0.1MM on integrated circuit components. This indicates we’re able to work with almost all kinds of integrated circuits, like SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and also U-BGA. Moreover, we’re able to provide 0201 chip placement, through-hole component insertion and final product manufacture, test and packing.

12-pwb-pcb-factories-01

STG

According to : http://www.china-pcbassembly.com/factory-view-n100-1.html

Turk-key Circuit Board assy solution company

(Support private-label Circuit Board )

STG is a reputable pro Circuit Board and PCBA producer in China, which supplies OEM/ODM service for worldwide purchasers . With years of experiences, STG is not simply a maker, but even a expert designer for new concepts, new innovations in line with customers. Our product selection contains various professions, including gadgets, telecommunications, industrial products , automotive assemblies, medical equipment and the like.

Our prime services consist of electronics and metal casing fabricating, for instance , printed circuit boards Circuit Board Mfg, part procuring, Circuit Board assy, plastic/metal house build, die-casting and custom-made Mfg. With experienced staff from STG properly trained, their capabilities will be impressive.

Email or call STG

China Shenzhen Office

Telephone: +86-0755-27929725
FAX: +86-0755-27929724
E-mail: sales@stgpcba.com

Location: Huolibao Building 5F , Technology Park, Nanshan, Shenzhen, 518100, China.
Web: china-pcbassembly.com

HK Office

Telephone: 852-36458129
Fax: 852-36458092
E-mail: marketing@stgpcba.com.
Location: 11/F FRONT BLK,HANG LOK BLDG 130 WING LOK ST,SHEUNG WAN, Hong Kong
Web-site: china-pcbassembly.com

12-pwb-pcb-factories-01

Asia Pacific Circuits – Turn-key service for Circuit Board Assy & Circuit Board Fabricating

Depending on : http://www.apc-pcbassembly.com/about-us-asia-pacific-circuits/

Asia Pacific Circuits Co., Ltd is an expert in Circuit Board mfg and assy, incorporating prototype and production PCBs. Here at APC We supply excellent and budget friendly Electronic Contract Manufacturing Services – including Circuit Board manufacture, components locating and one-stop PCB assy. With up to date factory and modern technology, we help consumers in a wide range of industries.

We are devoted to your whole satisfaction. Time to market is a symbol of how the company’s time-critical, Turn-key mfg services help purchasers to reduce the time necessary to develop new merchandise and push them to market.

Asia Pacific Circuits establishments are ISO9001-2008 approved, ISO 14001 (Environmental), UL Recognized, TS16949, TSTS13485 certified, IPC-A-600 and IPC-A-610 3 certified. We have a PCB assy factory and a Circuit Board manufacturing factory in China Shenzhen. APC business spectrum covers – Circuit Board Prototype, low to medium and high volume Circuit Board mfg and Circuit Board assy services.

Subsequent to APC team members 18 years of diligent efforts to form a exceptional sales network, We achieved a all-inclusive management system, received the ISO9001: 2008 international quality management system certification. We have a highly qualified sales, Circuit Board manufacturing and PCB assy under one roof, advance the sales operation and manufacturing and testing machines to make sure only quality boards are supplied to the shopper .

Speak to Us

Asia Pacific Circuits Co., Ltd
Office Telephone: +86-755-2758-4025
Office Fax: +86-755-2758-4028
E-mail: sales@apc-pcbassembly.com
Office Location: No. 55A, Baoan Ave, Bao’an District, Shenzhen , 518102, China
Manufacturing area Location: Gaoqiao Industrial Park East, Yanlong Ave, Longgang District, Shenzhen, China

12-pwb-pcb-factories-01

Shenzhen MOKO Tech Ltd

We Supply a Broad Selection of Printed Circuit Board Alternatives to Match Each of your PCB Needs.

Moko Tech Ltd created in 2001, positioned in Shenzhen, China. is experienced in PCB board fabricating + PCB board assy, located in Shenzhen, Guangdong, China. We are focused upon manufacturing single-sided , double-sided and multilayer board, to a maximum of 18 layers. What’s even better, we can provide parts acquisition and turn-key PCB board assy service.

With over ten years in the industry of PCB board prototype and manufacture, we’re focused upon fulfilling the goals of our clients coming from many industries concerning quality level, delivery, price and another request(s). Being among the many most professional PCB board manufacturers in China, we have confidence to become your most useful business partners .

In Shenzhen, we’re respected as the top-notch supplier for numerous businesses around the globe. We deliver all sorts of services including PCB board fabricating and PCB board assy for from prototype orders through batch orders.

Regarding PCB board assembling, with the help of 8 high-speed SMT assembling lines brought from Japan Yamaha and Sony, we do our uttermost to meet up with our consumers’ requirements.

One-stop Solution: In excess of Printed Circuit Board Fabricating

Our enhanced competence in printed circuit boards is not merely restricted to PCB board fabricating but also includes most relevant services like PCB board design / layout and PCB board assy. Our experienced design pros can make it easier to realize economical excellence in your multi-layer design or we’re able to design your circuit from nothing: from a simple double-sided board to challenging rigid-flex PCB applications. In 2012, our subcompany – Shenzhen Eastwin Trading Ltd founded in an effort to stretch international Market.

We possess our 25,000 sq. feet cutting edge manufacturing unit to make available the quality perfection you’re after…

We now have gained the ISO9001:2000, ISO14001, UL and ROHS certifications. At this point our PCB board volume has reached One thousand square meters on a daily basis, and as for PCB board assy can get to 100 mil items per 30 days.

We really recognize that our respectable service and expertise will entirely achieve your requires. Reliability and innovation are the power that result in our popularity. We are the most advantageous alternative to meet your requirements.

For further products and services, more incentives, or cost free trial samples please be sure to

Make Contact with Us

Shenzhen MOKO Tech Ltd.
Telphone: 86-75523573370
Fax: 86-75523573370-808
Mailbox: mike@szeastwin.com
Location : 4F,Buidling #2,Guanghui Science Zone,Minqing Road, Longhua Town, Shenzhen , China
Postal Code: 518109

In line with http://mokotechnology.com/about/

Vivo X20 Plus UD video Test 1080P



Test video da Vivo X20 PLUS UD !

LINK X20 PLUS UD; http://bit.ly/2BIWUvu

Link amazon per aiutare il canale; http://amzn.to/2hNK9Tp

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LA NUOVA INTRO E’ STATA CREATA DA ; http://intouchdesign.it/

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Telegram; http://telegram.me/gesu1978channel

Foto delle nostre riparazioni; http://telegram.me/gesu1978ripara
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Musica;

Song: Valence – Infinite [NCS Release]
Music provided by NoCopyrightSounds.
Video Link: https://youtu.be/QHoqD47gQG8

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Cosa uso per recensire;

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Technical SPECS of Vivo X20 Plus Cell Phone

GENERAL
Release date Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Detachable battery No
Colours Black
Display screen
Screen size (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor 1.8GHz octa-core
Processor Qualcomm Snapdragon 660
RAM 4GB
Internal storage space 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable TF card up to (GB) 256
CAMERA
Backside camera 12 mp
Rear Flash Yes
Selfie camera 12 mp
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infra-red No
USB OTG Yes
Earphones 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

VIVO X20 Plus UD – Screen இல் Fingerprint Scanner உடன் வரும் Smartphone!



Vivo X20 Plus UD – World’s First Under Display Fingerprint Scanner smartphone. This Complete Specs, Price, Camera and All features shown in this Video.
—————————
Buy Now
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VIVO X20 Plus UD ➡ Links will be Updated Soon

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Music Credits
—————————
Intro Music : Raven Kreyn – In The Air [NCS Release]

source

Specifications of Vivo X20 Plus Mobile

Basic
Release day Jan 2018
Sizes (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colors Black
DISPLAY
Screen measurement (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
Processor chip 1.8GHz octa-core
Processor chip Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable TF card up to (GB) 256
CAMERA
Back camera 12 megapixel
Rear Flash Yes
Front camera 12 megapixel
SOFTWARE
Operating-system Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
IR No
USB OTG Yes
Headsets 3.5mm
FM radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Vivo X20 Plus UD || World first under display fingerprint scanner phone || Hindi



Dossto recently hi vivo ne duniya ka phela under display wala phone vivo x20 plus ud ko unveil kar diya hai aur Is video me ham Ise phone ke bare me baat karnewale hai
Hope you enjoy

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Specifications of Vivo X20 Plus Mobile Phone

GENERAL
Release day January 2018
Measurements (mm) 165.20 x 80.09 x 7.35
Weight (g) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colours Black
DISPLAY
Display screen dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
CPU 1.8GHz octa-core
CPU Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable memory card up to (GB) 256
CAMERA
Backside camera 12 megapixel
Rear Flash Yes
Front camera 12 megapixel
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
IR No
USB OTG Yes
Headphones 3.5mm
Radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

Vivo X20 Plus VS Vivo X20 – Camera Stability test



Vivo X20 Plus VS Vivo X20 – Camera Stability test
This is really a cool video showing the stability of two vivo X20 cameras and it is up to you which from the two is good!!!

source

Specs of Vivo X20 Plus Mobile

GENERAL
Release date January 2018
Measurements (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Removable battery No
Colors Black
Screen
Display measurement (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 p
HARDWARE
CPU 1.8GHz octa-core
CPU Qualcomm Snapdragon 660
RAM 4GB
ROM 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Back camera 12 mega-pixel
Rear Flash Yes
Front camera 12 mega-pixel
SOFTWARE
Operating-system Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
Infra-red No
USB OTG Yes
Headphones 3.5mm
FM radio No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

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