Tag: Technology (page 1 of 3)

Qualcomm CES 2016 booth tour: Snapdragon 820, 820A, 802.11ad, 802.11ac, Windows Continuum and more



Qualcomm Snapdragon 820 is shown in a real phone in LeTV Le Max Pro, with Qualcomm saying that they have 80+ design wins for the Snapdragon 820 custom 64bit processor, now to be mass manufactured on Samsung’s 14nm process technology. Qualcomm also shows their Snapdragon 820 Adreno 530 GPU demos showing off high-end graphics, virtual reality and new display technologies, also Qualcomm WSA8815 audio technology for better sound coming out of built-in speakers for the Smartphones and Tablets market. Scanning people in realtime using Project Tango type structured scanner, IR camera. Qualcomm shows IoT technologies, Qualcomm Vive 802.11ac WiFi with multi-user mimo. Microsoft Windows 10 running on ultra-cheap Qualcomm 210, 410, and Windows continuum extending the Windows 10 desktop from the phone through to the external display using USB Type-C. Qualcomm Atheros Multi-Gigabit 60Ghz Wi-Fi 802.11ad included with the Snapdragon 820 LeTV Le Max Pro Smartphone! Matterport 360 degre camera supported by Qualcomm Ventures and other startups demonstrated. Qualcomm launches Qualcomm 820A for the automitive market and the modular system to upgrade the ARM Processor and PCB of the car to make it future proof.

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IoT PCB considerations for Startups

Since IoT products are so cutting edge, you would think that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and experiencing a lots of technical problem. That may be untrue.
Nevertheless it doesn’t convey IoT startups have a very clear way to fame and fortune. Facing them is a variety of design and manufacturing issues to consider which are completely unique to these small products. These factors to consider must be looked at for the new IoT device to hit your objectives.

On the plus side, it’s necessary for IoT startups to know that the basic foundation for a successful cool product exists. This means that experience and knowledge regarding the design, fabrication and assembly of these types of state-of-the-art products are accessible. Additionally, the most sage advice is for wise IoT product entrepreneurs and innovators to heed the counsel that veteran electronics manufacturing services or EMS providers have to give. These businesses along with their engineering employees have already practiced the job with groundbreaking IoT businesses in Silicon Valley getting into the very first of this coming market.

The PCB of an IoT device is a unique beast than the traditional one, which is much larger and flat. IoT devices, on the flip side, are made up largely of either rigid-flex or flex circuit assemblies, which come with their very own groups of design layout, fabrication and assembly factors to consider and nuances.

Layout

A top thing to consider is to hunt down qualified designers who’ve performed quite a lot of rigid-flex PCB designs. PCB space for an IoT device is limited. So you want the designer to have directly layout practical experience to correctly design critical elements on that modest space.

Simultaneously, virtually all IoT products are not fixed; they receive sizeable movement and rotating. Here, the qualified designer plays an essential role in working out bend ratios and lifecycle iterations as a vital part of a design. Additional critical design layout factors to consider consist of signal trace thickness, number of rigid and flex circuit layers, copper weight and stiffener placement. Stiffeners are used on flex circuits in order to guarantee elements connected to the flex circuit remain closely constantly in place to avoid movement.

One more thing to consider is through-hole component positioning in rigid-flex circuits. What makes that critical? A great deal of IoT units are founded upon surface mount device(SMD) placement. Nevertheless , there may be through-hole elements, which are usually attached to either the rigid portion or the flex part of the board. Through-hole elements are usually used to communicate input/output or I/O signals to the exterior world. Like that, those signals can be displayed by using an LCD or LED monitor. Through-hole component placement is a pretty important account in an IoT system considering that when used on the flex part of the board, appropriate stiffeners need to be designed and put to use for good assembly.

Last of all in the layout category, the high temperature that elements generate is required to be considered. IoT products are increasingly intricate with rigid-flex and flex circuits featuring in excess of 12 – 14 layers. A few products are digital. Nevertheless , ever more analog systems are being utilized in IoT systems. Analog circuitry causes even more heat than digital ones. As a consequence heat expansion and also contraction rate should be evaluated. In tech lingo, that is called the Coefficient of Thermal Expansion or CTE and the correct handling of it.

Fabrication

Selecting the best fabricator is very important and is linked to the EMS partner you’ve picked out. The fabricator you want should have IoT PCB fabrication practical experience. Among critical factors to consider here are making certain tough adhesions in between layers on both rigid and flex circuit sides, bearing in mind all of the crucial calculations and possessing a good know-how about when current transfers from the rigid side to the flex side.

Such fabricators also need to possess an in-depth comprehension of remarkably small parts for example 0201 as well as 00105 device packages, package-on-package, and the use of fine-pitch ball-grid array or BGA packaged devices.

They also need to have experience in designing boards with pretty tight tolerances in terms of footprint for those kinds of BGA devices, in terms of up-to-date capabilities like laser direct imaging for putting the solder mask on the board. They should have laser drills for via drilling with sizes of 5 mils or under mainly because these IoT devices could be so compact that a typical drill size of 5 to 8 mils probably won’t suffice. They could need to go to a 3 mil, which means that you should have an leading-edge laser drilling capability indoors.

In the event you are placing via-in-pad, it is a fantastic way to take advantage of the small real estate that is available on the rigid-flex board, but it produces difficulties for assembly. If vias aren’t entirely planar or flat in shape, it becomes a difficulty all through the assembly of those tiny BGA packaged devices. That is because non-planar surfaces may put at risk the integrity of solder joints.

Sometimes via in pads leave bumps if they’re not cleaned appropriately after adding the vias and gold finish on the top. In the event that there are bumps, then the solder joints in the assembly for those tiny BGA balls in those IoT devices wouldn’t be an excellent joint. It may create intermittent connections, which might be a larger issue to treat and mend. It all boils down to which EMS partner you are using because they’re the ones who will choose the fabrication plant to make a thriving IoT product for you.

PCB Assembly

It’s very important to pay a visit to qualified EMS companies that have efficiently assembled IoT and wearable PCBs because they have unique tooling and fixtures readily obtainable, which are essential for assembly to guarantee components are placed appropriately, accurately and the printing is carried out effectively.

Printing may be a issue for IoT systems. If it’s a rigid-flex board, then there exists a change between thicknesses of the rigid and flex circuit portions, which implies a special fixture is needed to maintain the complete rigid-flex board planar or totally flat to permit effective printing to become reached.

Startups need to be ready to decide on the correct manufacturing partners and EMS corporations. In this way they can ensure that they’ve ample experience in advance to get the multitude of design, fabrication and assembly details correctly performed because they are crucial to a prosperous and prompt IoT product roll-out.

Vivo X20 Plus UD Unboxing | Review | camera samples



This is the unboxing video of Vivo X20 Plus UD Unboxing: World’s First Under Display Fingerprint Sensor

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Specs of Vivo X20 Plus Smartphone

GENERAL
Release date January 2018
Measurements (mm) 165.20 x 80.09 x 7.35
Weight (grams) 181.5
Battery capacity (mAh) 3905
Easily-removed battery No
Colours Black
Display screen
Screen dimension (inches) 6.43
Touchscreen Yes
Resolution 1080×2160 pixels
HARDWARE
Processor 1.8GHz octa-core
Processor Qualcomm Snapdragon 660
RAM 4GB
Internal storage space 128GB
Expandable storage Yes
Expandable storage type microSD
Expandable storage up to (GB) 256
CAMERA
Rear camera 12 mega-pixel
Rear Flash Yes
Front camera 12 mega-pixel
SOFTWARE
Operating System Android 7.1
Skin FunTouch OS
CONNECTIVITY
Wi-Fi Yes
GPS Yes
Bluetooth Yes, v 5.00
NFC No
IR No
USB OTG Yes
Headphones 3.5mm
FM No
Number of SIMs 2
SIM 1
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SIM 2
SIM Type Nano-SIM
GSM/CDMA GSM
3G Yes
4G/ LTE Yes
Supports 4G in India (Band 40) Yes
SENSORS
Compass/ Magnetometer Yes
Proximity sensor Yes
Accelerometer Yes
Ambient light sensor Yes
Gyroscope Yes
Barometer No
Temperature sensor No

S1 Review: BLU’s First CDMA Smartphone!



The S1 is BLU’s first CDMA smartphone. In addition to supporting GSM carriers like T-Mobile and AT&T, the S1 also supports Sprint and Boost Mobile networks. What it does not support is Verizon’s network. For $180 off-contract, the S1 features a 5.2-inch HD display, octa-core processor with 2GB RAM, 13-megapixel main camera, 5-megapixel selfie camera, 2,800mAh battery, fingerprint scanner, and Android 7.0 Nougat. Will this be your next smartphone?

BLU S1 on Amazon: http://amzn.to/2j66IrE

Check out Beau HD’s personal channel: http://goo.gl/E5iM4N

PhoneDog: http://www.PhoneDog.com
Twitter: http://twitter.com/PhoneDog
Facebook: https://www.facebook.com/phonedog
Google Plus: https://plus.google.com/+phonedog
Instagram: http://instagram.com/phonedog

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BALANCING ROBOT USING ARDUINO AND MPU6050



It a video of making of Balancing Robot Electronic part on a single PCB. This robot is been made using Arduino pro mini, MPU 6050, Motor driver IC L298D, Voltage Regulator LM7805 and some other basic electronic components.

Source

Internet of Things PCB considerations for Startups

Considering the fact that IoT appliances are so new, you would assume that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and suffering from a great deal of technical complications. This is far from the truth.
However it doesn’t imply IoT startups have a apparent path to stardom. Facing them is a number of design and manufacturing concerns which are unique to these small products. These things to consider need to be taken into consideration for the new IoT device to be successful.

On the plus side, it’s a consideration for IoT startups to know that the basic foundation for a successful cool product exists. What this means is experience and knowledge concerning the design, fabrication and assembly of these cutting-edge products are obtainable. Also, the best advice is for prudent IoT product business people and forerunners to follow the recommendations that skilled electronics manufacturing services or EMS companies provide. These companies and also their engineering employees have already completed this work with groundbreaking IoT corporations in Silicon Valley participating in the first stages of this rising industry.

The PCB of an IoT device is a special beast than the traditional one, which is much larger and flat. IoT devices, in comparison, are made up generally of either rigid-flex or flex circuit assemblies, which come with their own categories of design layout, fabrication and assembly things to consider and intricacies.

Layout

A top thing to consider is to search for skilled designers who have undertaken quite a lot of rigid-flex PCB designs. PCB space for an IoT device is tight. So you want the designer to have firsthand layout practical experience to correctly design key elements on that small space.

Besides that, most IoT gadgets are not stationary; they incur substantial movement and folding. Right here, the skilled designer plays a key role in working out bend ratios and lifecycle iterations as a important part of a design. Additional key design layout things to consider comprise signal trace thickness, number of rigid and flex circuit layers, copper weight and stiffener placement. Stiffeners are used on flex circuits to be certain that elements mounted on the flex circuit stay tightly in place to stop movement.

One additional aspect to consider is through-hole element placement in rigid-flex circuits. What makes that significant? A great deal of IoT devices are based on surface mount device placement. However , there can be through-hole elements, which are typically attached to either the rigid section or the flex portion of the board. Through-hole elements are in general useful to communicate input/output or I/O signals to the outer world. Like that, those signals can show up having an LCD or LED monitor. Through-hole element placement is a crucial thing to consider in an IoT device since when utilized on the flex part of the board, proper stiffeners ought to be designed and employed for appropriate assembly.

Then finally in the layout category, the high temperature that elements deliver is required to be deemed. IoT gadgets are increasingly challenging with rigid-flex and flex circuits featuring up to 12 to 14 layers. Several gadgets are digital. However , increasingly more analog systems are being utilized in IoT systems. Analog circuitry makes far more heat than digital ones. This suggests heat expansion and contraction rate should be considered. In tech lingo, it is known as the Coefficient of Thermal Expansion or CTE and the proper treatments for it.

Fabrication

Selecting the best fabricator is important and is linked to the EMS firm you have chosen. The fabricator you expect needs to have IoT PCB fabrication experience. Among key things to consider here are making sure robust adhesions in between layers on both rigid and flex circuit sides, understanding all the essential calculations and possessing a strong comprehension of when current moves from the rigid side to the flex side.

These fabricators also must get an in-depth know-how about tremendously tiny parts for instance 0201 and also 00105 device packages, package-on-package, and the use of fine-pitch ball-grid array or BGA packaged devices.

They also need to have knowledge of designing boards with fairly tight tolerances in terms of footprint for those types of BGA devices, in terms of up-to-date capabilities like laser direct imaging for putting the solder mask on the board. They need to have laser drills for via drilling with sizes of 5 mils or under since these IoT products could be so tiny that a common drill size of 5 to 8 mils may well not be all you need. They may require to go to a 3 mil, which means that you have to have an cutting-edge laser drilling capability on-site.

If you’re placing via-in-pad, it’s a easy way to take advantage of the small land which is available on the rigid-flex board, nevertheless , it produces difficulties for assembly. If vias are not fully planar or flat in shape, it will be hard through the assembly of those tiny BGA packaged devices. That’s because non-planar surfaces may threaten the integrity of solder joints.

At times via in pads leave bumps in cases where they’re not scoured properly after positioning the vias and gold finish at the top. When there are bumps, then the solder joints in the assembly for those tiny BGA balls in those IoT devices wouldn’t be an excellent joint. It could create spotty connections, which can be a larger issue to treat and remedy. It all boils down to which EMS firm you are using because they’re the ones who will pick the fabrication facility to make a successful IoT product for you.

PCB Assembly

It’s crucial to head off to skilled EMS companies that have effectively assembled IoT and wearable PCBs since they have specialized tooling and fixtures readily obtainable, which are essential for assembly to make sure components are placed appropriately, precisely and the printing is completed effectively.

Printing can be a problem for IoT systems. If it’s a rigid-flex board, then you can find a difference between thicknesses of the rigid and flex circuit portions, which means a special fixture is required to retain the complete rigid-flex board planar or absolutely flat to allow effective printing to be carried out.

Startups should be all set to choose the correct manufacturing partners and EMS companies. In this manner they can make sure they’ve ample experience upfront to get the multitude of design, fabrication and assembly details effectively performed since they are essential to a triumphant and timely IoT product release.

48 hours with the Black Xiaomi Mi A1!



In this video, I give you my first impressions on the Xiaomi Mi A1 black variant after using it for 48 hours!

In my last video I talked about how my Redmi Note 4 has been with me through thick and thin and withstood several different accidents! Watch it here : https://goo.gl/Jxbais

Thanks to my buddy Dharmik for the shot of the gold Mi A1!
https://goo.gl/xqmT6x
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Check out the gear I used to make this video : https://goo.gl/DCnVTf
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Follow me in these places –

Snapchat – https://www.snapchat.com/add/techdevotedyt

Facebook – https://www.facebook.com/TechDevotedyt

Twitter – https://twitter.com/techdevotedyt

Instagram – https://www.instagram.com/suraj.jpg/
___
Intro track – Pressure by Clueless kit :
https://goo.gl/n46FG5

Background music : Little thoughts by Coldfusion

Outro track : Axel Thesleff – Bad Karma

___
In this video I’m going to give you my first impressions on the Xiaomi Mi A1 after using it for 48 hours. Now the first thing that striked my mind when I picked up the phone is actually how light it is. The weight distribution is quite even and it doesn’t feel really front or back heavy like some other phones and while on paper it is as heavy as the Redmi note 4 for some reason it feels quite a bit lighter in comparison. Maybe its just me.
While we’re on the topic of build quality and design, another thing I’ve come to like about it is the fingerprint sensor placement. Its on the back below the camera exactly where your finger would reside so by the time you take it out of your pocket its already unlocked! And I’m happy to report the sensor is a fast and accurate one. Oh and before I forget I also wanna talk about the color so the variant I have is the black one and I have also seen the gold in person and honestly I feel the gold doesnt look nearly as good as the black so even if you have to wait an extra week for the black trust me its worth it. Now firing up that display, we have a 5.5 inch FULLHD IPS panel that looks good and all but the bezels feel a bit too obnoxious and it doesnt really feel 2017-esque especially coming from the Bluboo S1. So thats gonna take a while to get used to.
Now speaking of performance so far its been extremely fluid typical snapdragon 625 style but more on that in the full review.
Now so far I havent been able to put the camera through its paces but judging by the quick samples I took, the 2x zoom seems to be working fine with little to no quality loss and the portrait mode seems like a hit or miss, edge detection isnt particularly great and it just seems artificial but then again its too early to say anything for sure.
Now perhaps the biggest selling point of this phone is that its running stock android. Xiaomi phones have always been a bit lacking in terms of software and updates but with the A1 thats clearly not the case. The experience offered here is very pixel-esque with only 4 Mi apps of which one is the Mi remote which is necessary for the IR blaster which btw is a first for an android phone so thats really neat!
If theres anything I dislike about the Mi A1, it has to be its battery capacity. At 3080 mAh its still better than a lot of phones but coming from a Redmi Note 4 its just not something I expected but again that said numbers are only half the story and the fact that its running stock android should really help.
So overall the Mi A1 is shaping up to be an amazing phone and while its too early for a final verdict, I think it’d be safe to say, this is the best android one phone we’ve had so far.
I’ll of course be doing the usual set of reviews but if theres any particular video youd like to see do let me know in the comments!

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Please watch: “What headphones do I use?”

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Xiaomi Mi A1

The Xiaomi Mi A1 is the first smartphone this year to debut with Google’s ambitious project, Android One. Also, the Mi A1 is Xiaomi’s first smartphone with a dual-camera setup to launch in India. It features a 12-megapixel Telephoto lens + 12-megapixel wide angle lens on the back. The smartphone ships with stock Android 7.0 Nougat.

In terms of features and specifications, the Mi A1 ships with a 5.5-inch full HD (1080p) display. It is powered by the Qualcomm Snapdragon 625 octa-core SoC aided by a 4GB of RAM. It has 64Gb of internal storage that can be further expanded using a microSD card slot.

Introducing Xiaomi Mi Max 2: Big Display, Bigger Battery



Mi Max 2 Unveiled: 6.44″ Display, 5300 mAh Battery & Quick Charge 3.0! See more: http://en.miui.com/thread-617857-1-1.html
MIUI Global Forum: http://en.miui.com/forum.php
Facebook: https://www.facebook.com/miuiromchina
Twitter: https://twitter.com/miuirom
Google plus: http://gplus.to/miuiofficial

MIUI is one of the most popular Android ROMs in the world. It is based on Android, featuring a rich user experience and user customizable themes. MIUI is updated every Friday based on feedback from its users.
Now with over 150 million users and 35 MIUI fan sites worldwide, MIUI is the choice of many Android users globally.

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Cooler Master CM Storm Trigger Z Mechanical Gaming Keyboard Review



http://www.nicolas11x12techx.com/
Nicolas11x12 reviewing the Cooler Master CM Storm Trigger Z Mechanical Gaming Keyboard.

Manufacturer: Cooler Master
Model: SGK-6010-GKCM1

Full Specifications:
http://gaming.coolermaster.com/en/products/keyboards/triggerz/

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Subject: Selecting A Good Keyboard Manufacturer And Supplier For Nice Results



View more details at http://www.jrmediaone.com/totalmobile

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Thermaltake Tt eSPORTS Poseidon Z RGB Mechanical Gaming Keyboard Review



Amazon US Link (Affiliate): http://amzn.to/2sHYy9e
Amazon UK Link (Affiliate): http://amzn.to/2reBnov
Nicolas11x12 reviewing the Thermaltake Tt eSPORTS Poseidon Z RGB Mechanical Gaming Keyboard.

Manufacturer: Tt eSPORTS
Model: KB-PZR-KLBRUS-01

Full Specifications:
http://www.ttesports.com/productPage.aspx?p=195&g=ftr#

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Mio Slice: more heart rate band than activity tracker | Ars Technica



Ars Technica’s Valentina Palladino reviews the Mio Slice, a wrist-based fitness band that is more a heart rate band than activity tracker. Read the article: https://arstechnica.com/gadgets/2017/03/mio-slice-review-heart-rate-done-right-but-style-is-still-a-struggle/

Connect with Ars Technica Magazine Online:
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Mio Slice: more heart rate band than activity tracker | Ars Technica

Producer: Jennifer Hahn
Editor: Jennifer Hahn

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