Qualcomm Snapdragon 820 is shown in a real phone in LeTV Le Max Pro, with Qualcomm saying that they have 80+ design wins for the Snapdragon 820 custom 64bit processor, now to be mass manufactured on Samsung’s 14nm process technology. Qualcomm also shows their Snapdragon 820 Adreno 530 GPU demos showing off high-end graphics, virtual reality and new display technologies, also Qualcomm WSA8815 audio technology for better sound coming out of built-in speakers for the Smartphones and Tablets market. Scanning people in realtime using Project Tango type structured scanner, IR camera. Qualcomm shows IoT technologies, Qualcomm Vive 802.11ac WiFi with multi-user mimo. Microsoft Windows 10 running on ultra-cheap Qualcomm 210, 410, and Windows continuum extending the Windows 10 desktop from the phone through to the external display using USB Type-C. Qualcomm Atheros Multi-Gigabit 60Ghz Wi-Fi 802.11ad included with the Snapdragon 820 LeTV Le Max Pro Smartphone! Matterport 360 degre camera supported by Qualcomm Ventures and other startups demonstrated. Qualcomm launches Qualcomm 820A for the automitive market and the modular system to upgrade the ARM Processor and PCB of the car to make it future proof.
IoT PCB considerations for Startups
Since IoT products are so cutting edge, you would think that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and experiencing a lots of technical problem. That may be untrue.
Nevertheless it doesn’t convey IoT startups have a very clear way to fame and fortune. Facing them is a variety of design and manufacturing issues to consider which are completely unique to these small products. These factors to consider must be looked at for the new IoT device to hit your objectives.
On the plus side, it’s necessary for IoT startups to know that the basic foundation for a successful cool product exists. This means that experience and knowledge regarding the design, fabrication and assembly of these types of state-of-the-art products are accessible. Additionally, the most sage advice is for wise IoT product entrepreneurs and innovators to heed the counsel that veteran electronics manufacturing services or EMS providers have to give. These businesses along with their engineering employees have already practiced the job with groundbreaking IoT businesses in Silicon Valley getting into the very first of this coming market.
The PCB of an IoT device is a unique beast than the traditional one, which is much larger and flat. IoT devices, on the flip side, are made up largely of either rigid-flex or flex circuit assemblies, which come with their very own groups of design layout, fabrication and assembly factors to consider and nuances.
A top thing to consider is to hunt down qualified designers who’ve performed quite a lot of rigid-flex PCB designs. PCB space for an IoT device is limited. So you want the designer to have directly layout practical experience to correctly design critical elements on that modest space.
Simultaneously, virtually all IoT products are not fixed; they receive sizeable movement and rotating. Here, the qualified designer plays an essential role in working out bend ratios and lifecycle iterations as a vital part of a design. Additional critical design layout factors to consider consist of signal trace thickness, number of rigid and flex circuit layers, copper weight and stiffener placement. Stiffeners are used on flex circuits in order to guarantee elements connected to the flex circuit remain closely constantly in place to avoid movement.
One more thing to consider is through-hole component positioning in rigid-flex circuits. What makes that critical? A great deal of IoT units are founded upon surface mount device(SMD) placement. Nevertheless , there may be through-hole elements, which are usually attached to either the rigid portion or the flex part of the board. Through-hole elements are usually used to communicate input/output or I/O signals to the exterior world. Like that, those signals can be displayed by using an LCD or LED monitor. Through-hole component placement is a pretty important account in an IoT system considering that when used on the flex part of the board, appropriate stiffeners need to be designed and put to use for good assembly.
Last of all in the layout category, the high temperature that elements generate is required to be considered. IoT products are increasingly intricate with rigid-flex and flex circuits featuring in excess of 12 – 14 layers. A few products are digital. Nevertheless , ever more analog systems are being utilized in IoT systems. Analog circuitry causes even more heat than digital ones. As a consequence heat expansion and also contraction rate should be evaluated. In tech lingo, that is called the Coefficient of Thermal Expansion or CTE and the correct handling of it.
Selecting the best fabricator is very important and is linked to the EMS partner you’ve picked out. The fabricator you want should have IoT PCB fabrication practical experience. Among critical factors to consider here are making certain tough adhesions in between layers on both rigid and flex circuit sides, bearing in mind all of the crucial calculations and possessing a good know-how about when current transfers from the rigid side to the flex side.
Such fabricators also need to possess an in-depth comprehension of remarkably small parts for example 0201 as well as 00105 device packages, package-on-package, and the use of fine-pitch ball-grid array or BGA packaged devices.
They also need to have experience in designing boards with pretty tight tolerances in terms of footprint for those kinds of BGA devices, in terms of up-to-date capabilities like laser direct imaging for putting the solder mask on the board. They should have laser drills for via drilling with sizes of 5 mils or under mainly because these IoT devices could be so compact that a typical drill size of 5 to 8 mils probably won’t suffice. They could need to go to a 3 mil, which means that you should have an leading-edge laser drilling capability indoors.
In the event you are placing via-in-pad, it is a fantastic way to take advantage of the small real estate that is available on the rigid-flex board, but it produces difficulties for assembly. If vias aren’t entirely planar or flat in shape, it becomes a difficulty all through the assembly of those tiny BGA packaged devices. That is because non-planar surfaces may put at risk the integrity of solder joints.
Sometimes via in pads leave bumps if they’re not cleaned appropriately after adding the vias and gold finish on the top. In the event that there are bumps, then the solder joints in the assembly for those tiny BGA balls in those IoT devices wouldn’t be an excellent joint. It may create intermittent connections, which might be a larger issue to treat and mend. It all boils down to which EMS partner you are using because they’re the ones who will choose the fabrication plant to make a thriving IoT product for you.
It’s very important to pay a visit to qualified EMS companies that have efficiently assembled IoT and wearable PCBs because they have unique tooling and fixtures readily obtainable, which are essential for assembly to guarantee components are placed appropriately, accurately and the printing is carried out effectively.
Printing may be a issue for IoT systems. If it’s a rigid-flex board, then there exists a change between thicknesses of the rigid and flex circuit portions, which implies a special fixture is needed to maintain the complete rigid-flex board planar or totally flat to permit effective printing to become reached.
Startups need to be ready to decide on the correct manufacturing partners and EMS corporations. In this way they can ensure that they’ve ample experience in advance to get the multitude of design, fabrication and assembly details correctly performed because they are crucial to a prosperous and prompt IoT product roll-out.